September 19, 2018

Your machine experts for forming, filling and sealing - KOCH at the PACK EXPO 2018 in Chicago

The PACK EXPO Chicago - on of the most important packaging trade show in America - will take place from 14th to the 17th of October at the McCormick Place in Chicago. Over 2,500 international exhibitors will meet over 50,000 trade show visitors.

KOCH Pac-Systeme will showcase a blister machine KBS-PL in live operation, for high-volume packaging with the same or similar products for maximum productivity. Serving the medical device, consumer products and contact lens industries.

With the digital performance package KOCH K 4.0 for digitalization in special machine manufacturing, KOCH Packaging Systems will present one of the the latest innovation from Germany.

We are looking forward to interesting conversations at the south hall, booth S-1769!

Contact KOCH USA

Brochure machine portfolio consumer products

Brochure machine portfolio medical technology (medplus)