August 17, 2017

KOCH is digital - live at the PACK EXPO 2017 in Las Vegas

The PACK EXPO Las Vegas - arguably the most important packaging trade fair in America this year - will take place from 25th to the 27th of September at the Convention Center Las Vegas. Over 2,000 international top exhibitors will meet over 30,000 trade Show visitors.

With the digital performance package KOCH K 4.0 for digitalization in special machine manufacturing, KOCH Packaging Systems will present the latest innovation from Germany. "Faster, better, easier, more convenient" - these are the main advantages KOCH offers all customer with our K 4.0 innovations.

In addition to the digital performance package, KOCH will showcase a blister machine KBS-PL in live operation, for high-volume packaging with the same or similar products for maximum productivity. Serving the medical device, consumer products and contact lens industries.

We are looking forward to interesting conversations at our booth 6378 in the South Hall!

Contact person KOCH USA